Laser based wafer dicing

Today, in the backend of the semiconductor manufacturing process, wafers are usually separated into dies by mechanical sawing. Although sawing is the standard process, it's connected with some disadvantages like chipping, micro cracks and significant yield loss as result of the an innovative alternative to increase yield and throughput in combination with excellent mechanical and electrical product properties and a minimal cost of ownership. After the basics, benefits and limits of the technology a comparison of TLS with other known (laser-) dicing-technologies will be presented. The presentation will be completed by a status report about the application results and the prototype system itself.